导热硅胶片

UTP100-H10-9是使用硅胶与导热陶瓷填料，以玻璃纤维布为补强材料，经特殊工艺加工而成。具单面自粘型，防刺穿，抗击电压增强，是一款非常柔软，具有优异的可压缩性的导热硅胶垫片，可与电子元器件紧密接触，有效降低界面热阻，导热性能表现极佳。在-40℃~150℃可以稳定工作，同时满足UL94 V-0等级阻燃要求。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP700-H65-9是一款高导热性能的材料，双面自粘，与电子组件装配使用时，低压缩力下表现出较低的热阻和较好的电气绝缘特性 。在-40℃~150℃可以稳定工作，满足UL94 V-0的阻燃等级要求。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP1500-H40-Q是一款无交联的高导热有机硅导热垫片，导热系数15W/(m⋅K)，无交联状态使其没有橡胶的回弹性，但是具有非常好的压缩性且高压缩后应力非常小，易于装配。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP1200-H65-9是一款12.0W/(m·K)的高导热性能 的材料，表面弱粘性，适用于大功率发热元器件 的导热散热系统，可用于填充小缝隙和不均匀表 面，满足UL94V-0的阻燃等级要求。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP1000-H65-9是一款10.0W/(m·K)的高导热性能 的材料，表面弱粘性，适用于大功率发热元器件 的导热散热系统，可用于填充小缝隙和不均匀表 面，满足UL94V-0的阻燃等级要求。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP800-H60-9是一款高导热性能的材料，表面一致性非常好，可用于填充小缝隙和不均匀表面，与各种形状和尺寸部件进行均匀接触，低压缩力下表现出较低的热阻和较好的电气绝缘特性。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP600-H40-9导热硅胶片是一款高导热性能的材料，双面自粘，与电子组件装配使用时，低压缩力下表现出较低的热阻和较好的电气绝缘特性。在-40℃~150℃可以稳定工作，满足UL94V-0的阻燃等级要求 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->

TP500-H40-9是一款高导热性能的材料，双面自粘，与电子组件装配使用时，低压缩力下表现出较低的热阻和较好的电气绝缘特性，在40℃~150℃可以稳定工作，满足UL94V-0的阻燃等级要求。 <!-- AOK_APPLICATION_GUIDE_V1_START --> <section class="aok-selection-guide" data-aok-block="selection-guide-v4" style="margin:40px 0 0;box-sizing:border-box;"> <div class="aok-section-header" style="margin-left:-19px;margin-right:0;"> <div class="header-main"> <h2 class="zh">选型建议</h2> <span class="en">SELECTION GUIDE</span> </div> </div> <div style="display:grid;grid-template-columns:repeat(auto-fit,minmax(240px,1fr));gap:18px;margin:0;"> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">01</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">适用界面位置</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">适合器件、板卡与散热器或壳体之间存在中大间隙的界面，通过受控压缩填补高度差和表面空隙。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">02</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">材料在热路径中的作用</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">片材便于模切、定位和返修，适用于规则表面及多器件共用散热结构；材料需要在目标压力下保持连续贴合。</p> </div> </article> <article style="display:flex;align-items:flex-start;gap:16px;padding:22px;background:#ffffff;border:1px solid #edf1f5;border-radius:8px;box-sizing:border-box;"> <span style="flex:0 0 auto;color:#e60012;font-family:Arial,sans-serif;font-size:26px;line-height:1;font-weight:800;opacity:.22;">03</span> <div> <h3 style="margin:0 0 8px;color:#1e293b;font-size:16px;line-height:1.5;font-weight:700;">选型前需要确认</h3> <p style="margin:0;color:#64748b;font-size:14px;line-height:1.75;letter-spacing:0;">优先确认最大与最小间隙、厚度公差、允许压缩率、器件承压、绝缘要求、阻燃要求及热循环后的压缩保持。</p> </div> </article> </div> <div style="margin:18px 0 0;padding:15px 0 0;border-top:1px solid #edf1f5;box-sizing:border-box;"> <p style="margin:0;color:#64748b;font-size:13px;line-height:1.75;letter-spacing:0;"><strong style="color:#1e293b;">验证建议：</strong>在真实间隙、压力、功耗和冷却条件下完成样品装配、温升与可靠性测试；最终以傲川正式TDS、测试报告和项目验证结果为准。</p> </div> </section> <!-- AOK_APPLICATION_GUIDE_V1_END -->